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The consumer handheld market is growing by leaps and bounds. With more processing power and increased support for more applications, portable products are cross-pollinating with traditional computing systems even as the product life cycle has decreased considerably in this market segment. As a result, especially in this era of economic slowdown, it is imperative that new products meet the time-to-market window to gain maximum acceptance. A decrease in product life cycles requires a reduced development cycle and an increased emphasis on reusability and reprogrammability. The emerging handheld market is also seeing interesting trends in which each individual device in a family has lower volumes but there is more customization across the series of devices, effectively upping the total unit volumes. The key challenge then becomes how to develop a system that is widely reusable and also customizable. These requirements have led designers increasingly to turn to the FPGA for handheld-product development. The FPGA has become more powerful and feature-rich, while gate counts, area and frequency have increased. FPGA development and turnaround cycles are considerably shorter than those of custom ASICs, and the added advantage of reprogrammability can make the FPGA a more compelling solution for handheld embedded systems.

The first textbook of its kind, Programming Massively Parallel Processors: A Hands-on Approach launches today, authored by Dr. David B. Kirk, NVIDIA Fellow and former chief scientist, and Dr. Wen-mei Hwu, who serves at the University of Illinois at Urbana-Champaign as Chair of Electrical and Computer Engineering in the Coordinated Science Laboratory, co-director of the Universal Parallel Computing Research Center and principal investigator of the CUDA Center of Excellence. The textbook, which is 256 pages, is the first aimed at teaching advanced students and professionals the basic concepts of parallel programming and GPU architectures. Published by Morgan Kaufmann, it explores various techniques for constructing parallel programs and reviews numerous case studies. With conventional CPU-based computing no longer scaling in performance and the world’s computational challenges increasing in complexity, the need for massively parallel processing has never been greater. GPUs have hundreds of cores capable of delivering transformative performance increases across a wide range of computational challenges. The rise of these multi-core architectures has raised the need to teach advanced programmers a new and essential skill: how to program massively parallel processors.

In addition to voice connectivity, digital cellular wireless networks such as GSM and its enhancement, GSM-EDGE, can now provide increased data speeds up to a (theoretical) limit of 384ﾠKbps. Third generation mobile networks, such as CDMA2000 and WCDMA or UMTS (Universal Mobile Telecommunications Standards) and TD-SCDMA (China only) are currently being deployed worldwide. These systems offer services such as video streaming, Internet browsing and, by using a technique called High Speed Packet Access (HSPA), they can in theory deliver downlink speeds up to 14,4 Mbps.

Events such as natural disasters, military actions, and public safety threats have led to an increased need for robust robots — especially ones that can travel across complex terrain in any dimension. The ability to scale vertical building surfaces or other structures offers unique capabilities in military applications such as urban reconnaissance, sensor deployment, and setting up urban network nodes. SRI's novel clamping technology, called compliant electroadhesion, has enabled the first application of this technology to wall-climbing robots that can help with these situations.  As the name implies, electroadhesion is an electrically controllable adhesion technology. It involves inducing electrostatic charges on a wall substrate using a power supply connected to compliant pads situated on the moving robot. SRI has demonstrated robust clamping to common building materials including glass, wood, metal, concrete, etc. with clamping pressures in the range of 0.5 to 1.5 N per square cm of clamp (0.8 to 2.3 pounds per square inch). The technology works on conductive and non-conductive substrates, smooth or rough materials, and through dust and debris. Unlike conventional adhesives or dry adhesives, the electroadhesion can be modulated or turned off for mobility or cleaning. The technology uses a very small amount of power (on the order of 20 microwatts/Newton weight held) and shows the ability to repeatably clamp to wall substrates that are heavily covered in dust or other debris.

With the consumer demand for richer content and its resultant , increasing high data bandwidth continuing to drive communications systems, coding for error control has become extraordinarily important. One way to improve the bit error rate (BER), while maintaining high data reliability, is to use an error correction technique like the Viterbi algorithm. Originally conceived by Andrew Viterbi as an error-correction scheme for noisy digital communication, the Viterbi algorithm provides an efficient method for forward error correction (FEC) that improves channel reliability. Today, it is used in many digital communications systems in applications as diverse as CDMA and GSM digital cellular, dial-up modems, satellite, deep-space communications and 802.11 wireless LANs. It is also commonly used in speech recognition, keyword spotting and computational linguistics.

DMA is used in almost every complex system or subsystems, but it's observed that teams either build the DMA controller from scratch for each project for specific application or take the existing DMAC available from elsewhere. This article discusses the architecture of DMAC that can be used with any kind of Bus, configuration (parallel, serial transfers), can be connected to any kind of ports, most importantly any kind of software assumptions can be implemented in the DMAC very easily.

PC-compatible industrial computers are increasing in computing power at a rapid rate due to the availability of multi-core microprocessor chips, and Microsoft Windows has become the de-facto software platform for implementing human-machine interfaces (HMIs). PCs are also becoming more reliable. With these trends, the practice of building robotic systems as complex multi-architecture, multi-platform systems is being challenged. It is now becoming possible to integrate all the functions of machine control and HMI into a single platform, without sacrificing performance and reliability of processing. Through new developments in software, we are seeing industrial systems evolving to better integrate Windows with real-time functionality such as machine vision and motion control. Software support to simplify motion control algorithm implementation already exists for the Intel processor architecture.

In then the past few years we have seen multiprocessing systems become more mainstream, in fact most modern personal computer CPUs now feature symmetric multiprocessing systems (SMP), where multiple instantiations of the same processor share the processing burden of the applications running on the PC. While SMPs are quite common today, we typically have not seen a shift towards multiprocessing in embedded computing. However, a new type of embedded design technique gives engineers the freedom to intelligently distribute processing functions across a digital subsystem. This article will look at an example of the distributed processing technique using Cypress Semiconductor's PSoC 3 and PSoC 5 architectures, which consist of a main CPU (in this case an 8051 or ARM Cortex M3), a DMA engine, and array of Universal Digital Blocks (UDB).

Verification of algorithm-intensive systems is a long, costly process. Studies show that the majority of flaws in embedded systems are introduced at the specification stage, but are not detected until late in the development process. These flaws are the dominant cause of project delays and a major contributor to engineering costs. For algorithm-intensive systems —including systems with communications, audio, video, imaging, and navigation functions— these delays and costs are exploding as system complexity increases. It doesn't have to be this way. Many designers of algorithm-intensive systems already have the tools they need to get verification under control. Engineers can use these same tools to build system models that help them find and correct problems earlier in the development process. This can not only reduce verification time, but also improves the performance of their designs. In this article, we'll explain three practical approaches to early verification that make this possible. First, let's examine why the current algorithm verification process is inefficient and error-prone. In a typical workflow, designs start with algorithm developers, who pass the design to hardware and software teams using specification documents.

Supporting the Wind River Systems VxWorks operating system on Intel architecture is valuable for customers who would like to preserve their application software and evaluate other architectures for comparison purposes or for architecture conversion. Products from Wind River Systems, particularly VxWorks, offer a great opportunity to address multiple architectures with the same real-time operating system (RTOS). Furthermore, the continuous development and migration of multicore platforms has increased the focus on migrating software to multicore and performance optimizations given a specified software workload and certain hardware resources.

Three-dimensional microchip designs are making their way to market to help pack more transistors on a chip as traditional scaling slows down. By stacking logic chips on top of one another other or combining logic chips with memory or RF with logic, chipmakers hope to sidestep Moore's Law, increasing the functionality of smartphones and other gadgets not by shrinking a chip's transistors but the distance between them. "There's a big demand for smaller packages in the consumer market, especially for the footprint of a mobile phone, or for improving the memory bandwidth of your GPU," says Pol Marchal, a principal scientist of 3-D integration at European microelectronics R&D center Imec. On 9 February, at the IEEE International Solid-State Circuits Conference (ISSCC), in San Francisco, Imec engineers presented some key design challenges facing 3-D chips made by stacking layers of silicon circuits using vertical copper interconnects called through-silicon vias (TSVs). These design constraints will have to be dealt with before TSVs can be widely used in advanced microchip architectures, Marchal says.

When considering the resolution required for an A/D converter (ADC) integrated in a microcontroller (MCU), embedded systems designers must balance cost and performance. Higher ADC resolution implies higher-cost MCUs, but in some cases you can use other features in the MCU to enhance the ADC performance via software. That approach lets you achieve higher resolution using an inexpensive integrated ADC. Here's how to use of oversampling to achieve extra bits of resolution for an ADC integrated in an MCU.

Predicting trends is difficult even by the most connected industry experts, but one trend that's easy to spot is the widespread acceptance of multicore SoC. This is happening for a number of reasons. First, it's been years since the workstation first adopted the multicore processor architecture to solve such issues as increasing performance and power concerns. While the adoption rate in workstations is now saturated and is fully supported by General Purpose OSs (GPOS), the embedded world is just now looking at ways to adopt multicore architecture. Second, several SoC vendors have been providing multicore solutions including Cavium, Freescale, MIPS, and ARM; but up until now, these solutions have been limited to networking and used for performance enhancements rather than for low power. The rest of the embedded industry has had limited hardware options available as low-power design is a driving factor. While the ARM 11 MPCore was ahead of its time, the Cortex-A9 MPCore design is ready for primetime and is gaining acceptance in the embedded marketplace. As a result, SoC vendors have adopted the Cortex-A9 MPCore hardware as a basis for their next generation designs. Over a year ago, Texas Instruments pre-announced their next-generation OMAP designs in the OMAP 4 with a dual-core Cortex-A9 MPCore, scheduled for production in the second-half of 2010. ST Microsystems has pre-announced their next generation consumer devices which will be based on the Cortex A9 MPCore.