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Ever since graphene was first produced in a lab at the University of Manchester in 2004, researchers around the world have been fascinated with its potential in electronics applications. Graphene possessed all the benefits of carbon nanotubes (CNTs), namely its charged-carrier mobility, but it didn’t have any of the down sides, such as CNTs’ need for different processing techniques than silicon and the intrinsic difficulty of creating interconnects for CNTs. But all was not easy for applying graphene to electronics applications. One of the fundamental problems for graphene was its lack of a band gap, which left it with a very low on-off ratio measured at about 10 as compared to in the 100s for silicon. Now this fundamental hurdle has been overcome. Based on research led by Phaedon Avouris at IBM’s IBM T.J. Watson Research Center, Yorktown Heights, New York, IBM is reporting that they have created a significant band gap in graphene.

Predicting trends is difficult even by the most connected industry experts, but one trend that's easy to spot is the widespread acceptance of multicore SoC. This is happening for a number of reasons. First, it's been years since the workstation first adopted the multicore processor architecture to solve such issues as increasing performance and power concerns. While the adoption rate in workstations is now saturated and is fully supported by General Purpose OSs (GPOS), the embedded world is just now looking at ways to adopt multicore architecture. Second, several SoC vendors have been providing multicore solutions including Cavium, Freescale, MIPS, and ARM; but up until now, these solutions have been limited to networking and used for performance enhancements rather than for low power. The rest of the embedded industry has had limited hardware options available as low-power design is a driving factor. While the ARM 11 MPCore was ahead of its time, the Cortex-A9 MPCore design is ready for primetime and is gaining acceptance in the embedded marketplace. As a result, SoC vendors have adopted the Cortex-A9 MPCore hardware as a basis for their next generation designs. Over a year ago, Texas Instruments pre-announced their next-generation OMAP designs in the OMAP 4 with a dual-core Cortex-A9 MPCore, scheduled for production in the second-half of 2010. ST Microsystems has pre-announced their next generation consumer devices which will be based on the Cortex A9 MPCore.

Within the next three years, the U.S. military will test the feasibility of sending a quadruped robot out into the field as a trusty pack mule to carry supplies for its troops, wherever they go. If the testing goes well for Boston Dynamics's Legged Squad Support System (LS3), company founder Marc Raibert will have come a long way from the one-legged hopping robots he pioneered in the 1980s. Actually Raibert has already come a long way, to the point where the U.S. Defense Advanced Research Projects Agency's (DARPA) Tactical Technology Office and the U.S. Marine Corps awarded his company a 30-month, $32-million contract last week to deliver a prototype LS3. This would be the first step in fulfilling the military's call for an autonomous, legged robot that can carry up to 181 kilograms of supplies for at least 32 kilometers without refueling.

Three-dimensional microchip designs are making their way to market to help pack more transistors on a chip as traditional scaling slows down. By stacking logic chips on top of one another other or combining logic chips with memory or RF with logic, chipmakers hope to sidestep Moore's Law, increasing the functionality of smartphones and other gadgets not by shrinking a chip's transistors but the distance between them. "There's a big demand for smaller packages in the consumer market, especially for the footprint of a mobile phone, or for improving the memory bandwidth of your GPU," says Pol Marchal, a principal scientist of 3-D integration at European microelectronics R&D center Imec. On 9 February, at the IEEE International Solid-State Circuits Conference (ISSCC), in San Francisco, Imec engineers presented some key design challenges facing 3-D chips made by stacking layers of silicon circuits using vertical copper interconnects called through-silicon vias (TSVs). These design constraints will have to be dealt with before TSVs can be widely used in advanced microchip architectures, Marchal says.

With the consumer demand for richer content and its resultant , increasing high data bandwidth continuing to drive communications systems, coding for error control has become extraordinarily important. One way to improve the bit error rate (BER), while maintaining high data reliability, is to use an error correction technique like the Viterbi algorithm. Originally conceived by Andrew Viterbi as an error-correction scheme for noisy digital communication, the Viterbi algorithm provides an efficient method for forward error correction (FEC) that improves channel reliability. Today, it is used in many digital communications systems in applications as diverse as CDMA and GSM digital cellular, dial-up modems, satellite, deep-space communications and 802.11 wireless LANs. It is also commonly used in speech recognition, keyword spotting and computational linguistics.

Multisim 11 is the latest version of its circuit simulation software, with specialized editions for both hands-on learning and professional circuit design. The easy-to-use Multisim software delivers a graphical approach that abstracts the complexities of traditional circuit simulation, helping educators, students and engineers employ advanced circuit analysis technology. The academic edition of Multisim 11 incorporates specialized teaching features and is complemented by circuits textbooks and courseware. This integrated system helps educators engage students and reinforce circuit theory with an interactive, hands-on approach to investigating circuit behavior. Multisim 11 Professional helps engineers optimize circuit designs, minimize errors and reduce prototype iterations. When combined with the new NI Ultiboard 11 layout and routing software, Multisim provides engineers a cost-effective, end-to-end prototyping platform. Its integration with NI LabVIEW measurement software also helps engineers define custom analyses to improve design validation…

A product can be of low quality for several reasons, such as it was shoddily manufactured, its components were improperly designed, its architecture was poorly conceived, and the product's requirements were poorly understood. Quality must be designed in. You can't test out enough bugs to deliver a high-quality product. The quality assurance (QA) process is vital for the delivery of a satisfactory system. In this last part in this series, we will concentrate on portions of the methodology particularly aimed at improving the quality of the resulting system. The software testing techniques described earlier in this series constitute one component of quality assurance, but the pursuit of quality extends throughout the design flow. For example, settling on the proper requirements and specification cannot be overlooked as an important determinant of quality. If the system is too difficult to design, it will probably be difficult to keep it working properly.