Group items tagged

The first textbook of its kind, Programming Massively Parallel Processors: A Hands-on Approach launches today, authored by Dr. David B. Kirk, NVIDIA Fellow and former chief scientist, and Dr. Wen-mei Hwu, who serves at the University of Illinois at Urbana-Champaign as Chair of Electrical and Computer Engineering in the Coordinated Science Laboratory, co-director of the Universal Parallel Computing Research Center and principal investigator of the CUDA Center of Excellence. The textbook, which is 256 pages, is the first aimed at teaching advanced students and professionals the basic concepts of parallel programming and GPU architectures. Published by Morgan Kaufmann, it explores various techniques for constructing parallel programs and reviews numerous case studies. With conventional CPU-based computing no longer scaling in performance and the world’s computational challenges increasing in complexity, the need for massively parallel processing has never been greater. GPUs have hundreds of cores capable of delivering transformative performance increases across a wide range of computational challenges. The rise of these multi-core architectures has raised the need to teach advanced programmers a new and essential skill: how to program massively parallel processors.

Three-dimensional microchip designs are making their way to market to help pack more transistors on a chip as traditional scaling slows down. By stacking logic chips on top of one another other or combining logic chips with memory or RF with logic, chipmakers hope to sidestep Moore's Law, increasing the functionality of smartphones and other gadgets not by shrinking a chip's transistors but the distance between them. "There's a big demand for smaller packages in the consumer market, especially for the footprint of a mobile phone, or for improving the memory bandwidth of your GPU," says Pol Marchal, a principal scientist of 3-D integration at European microelectronics R&D center Imec. On 9 February, at the IEEE International Solid-State Circuits Conference (ISSCC), in San Francisco, Imec engineers presented some key design challenges facing 3-D chips made by stacking layers of silicon circuits using vertical copper interconnects called through-silicon vias (TSVs). These design constraints will have to be dealt with before TSVs can be widely used in advanced microchip architectures, Marchal says.