Group items matching

in title, tags, annotations or url

Given the maturity of MOSFETs, selecting one for your next design may seem deceptively simple. Engineers are familiar with the figures of merit on a MOSFET data sheet. Selecting a MOSFET requires the engineer to use their expertise in scrutinizing different specifications for individual applications. In an application such as a load switch in a server power supply, the switching aspects of a MOSFET matter little because the MOSFET is on almost 100% of the time. The on resistance (RDS(ON)) may be the key figure of merit in such an application. Still other applications, including switching power supplies, use MOSFETs as active switches, and cause the engineer to value other MOSFET performance parameters. Let us consider some applications and their prioritization of MOSFET specifications.

The embedded world is constantly changing. You might not have noticed, but if you take a minute to recall what a microcontroller system was like 10 years ago and compare it to today's latest microcontroller systems, you will find that PCB design, component packages, level of integration, clock speed, and memory size have all going through several generations of change. One of the hottest topics in this area is when will the last of remaining 8-bit microcontroller users start to move away from legacy architectures and move to modern 32-bit processor architectures like the ARM Cortex-M based microcontroller family. Over the last few years there has been a strong momentum of embedded developers starting the migration to 32-bit microcontrollers and, in this multi-part article, we will take a look at some of the factors accelerating this migration.

The marriage of high performance optics with microfluidics could prove the perfect match for making lab-on-a-chip technologies more practical. Microfluidics, the ability to manipulate tiny volumes of liquid, is at the heart of many lab-on-a-chip devices. Such platforms can automatically mix and filter chemicals, making them ideal for disease detection and environmental sensing. The performance of these devices, however, is typically inferior to larger scale laboratory equipment. While lab-on-a-chip systems can deliver and manipulate millions of liquid drops, there is not an equally scalable and efficient way to detect the activity, such as biological reactions, within the drops.

The ARM Cortex™-M4 processor is the latest embedded processor by ARM specifically developed to address digital signal control markets that demand an efficient, easy-to-use blend of control and signal processing capabilities. The combination of high-efficiency signal processing functionality with the low-power, low cost and ease-of-use benefits of the Cortex-M family of processors is designed to satisfy the emerging category of flexible solutions specifically targeting the motor control, automotive, power management, embedded audio and industrial automation markets. The Cortex-M4 processor features extended single-cycle multiply-accumulate (MAC) instructions, optimized SIMD arithmetic, saturating arithmetic instructions and an optional single precision Floating Point Unit (FPU). These features build upon the innovative technology that characterizes the ARM Cortex-M series processors…

Ever since graphene was first produced in a lab at the University of Manchester in 2004, researchers around the world have been fascinated with its potential in electronics applications. Graphene possessed all the benefits of carbon nanotubes (CNTs), namely its charged-carrier mobility, but it didn’t have any of the down sides, such as CNTs’ need for different processing techniques than silicon and the intrinsic difficulty of creating interconnects for CNTs. But all was not easy for applying graphene to electronics applications. One of the fundamental problems for graphene was its lack of a band gap, which left it with a very low on-off ratio measured at about 10 as compared to in the 100s for silicon. Now this fundamental hurdle has been overcome. Based on research led by Phaedon Avouris at IBM’s IBM T.J. Watson Research Center, Yorktown Heights, New York, IBM is reporting that they have created a significant band gap in graphene.

Not so long ago, artists routinely made their own paints using all sorts of odd ingredients: clay, linseed oil, ground-up insects—whatever worked. It was a crude and rather ad hoc process, but the results were used to create some of the greatest paintings in the world. Today I and other scientists are developing our own special paints. We’re not trying to compete with Vermeer or Gauguin, though. We hope to create masterpieces of a more technical nature: optoelectronic components that will make for better photovoltaic cells, imaging sensors, and optical communications equipment. And we’re not mixing and matching ingredients quite so haphazardly. Instead, we’re using our blossoming understanding of the world of nanomaterials to design the constituents of our paints at the molecular level.

Scientists have great expectations that nanotechnologies will bring them closer to the goal of creating computer systems that can simulate and emulate the brain's abilities for sensation, perception, action, interaction and cognition while rivaling its low power consumption and compact size. DARPA for instance, the U.S. military's research outfit known for projects that are pushing the envelope on what is technologically possible, has a program called SyNAPSE that is trying to develop electronic neuromorphic machine technology that scales to biological levels. Started in late 2008 and funded with $4.9 million, the goal of the initial phase of the SyNAPSE project is to "develop nanometer scale electronic synaptic components capable of adapting the connection strength between two neurons in a manner analogous to that seen in biological systems, as well as, simulate the utility of these synaptic components in core microcircuits that support the overall system architecture."

Three-dimensional microchip designs are making their way to market to help pack more transistors on a chip as traditional scaling slows down. By stacking logic chips on top of one another other or combining logic chips with memory or RF with logic, chipmakers hope to sidestep Moore's Law, increasing the functionality of smartphones and other gadgets not by shrinking a chip's transistors but the distance between them. "There's a big demand for smaller packages in the consumer market, especially for the footprint of a mobile phone, or for improving the memory bandwidth of your GPU," says Pol Marchal, a principal scientist of 3-D integration at European microelectronics R&D center Imec. On 9 February, at the IEEE International Solid-State Circuits Conference (ISSCC), in San Francisco, Imec engineers presented some key design challenges facing 3-D chips made by stacking layers of silicon circuits using vertical copper interconnects called through-silicon vias (TSVs). These design constraints will have to be dealt with before TSVs can be widely used in advanced microchip architectures, Marchal says.

In 2008 a team of physicists from Argonne National Laboratory, in Illinois, and other institutions stumbled upon an odd phenomenon. They called it superinsulation, because in many ways it was the opposite of superconductivity. Now they’ve worked out the theory behind it, potentially opening the doors to better batteries, supersensitive sensors, and strange new circuits. Superconductors lose all resistance once they fall below a certain temperature. In superinsulators, on the other hand, the resistance to the flow of electricity becomes infinite at very low temperatures, preventing any flow of electric current.

The design of a generator system requires many hours of detailed planning with the goal of creating an extremely reliable backup power source. Properly installed, the system will deliver the intended level of reliability. However, if incorrectly wired, the system can become a problem for both the owner and the manufacturer. While the generator installation can be handled by a range of people, from a trained technician to the typical homeowner, wiring mistakes can occur. Installation includes working with 120 VAC split phase, 240 V line voltage, along with low-voltage signals below 50 V. A small and easily made mistake, such as miswiring high voltage to low voltage, will destroy sensitive electronics quickly and may render the equipment inoperable. Thus, a resettable overcurrent and overvoltage solution capable of handling line voltage, electrostatic discharge (ESD), electrical fast transients (EFT), and current surge is required to protect low voltage interface circuits against this problem.

A transistor that emits light and is made from organic materials could lead to cheaper digital displays and fast-switching light sources on computer chips, according to the researchers who built it. Small displays made from diodes of the same type of materials (organic light-emitting diodes, or OLEDs) are already in commercial production, but the transistor design could improve on those and lead to applications where OLEDs can’t go. The new organic light-emitting transistor (OLET) is much more efficient than previous designs. It has an external quantum efficiency—a key measure of how much light comes out per charge carrier pumped in—of 5 percent. An OLED based on the same material has a quantum efficiency of only 2 percent. Previous OLET designs had an efficiency of only 0.6 percent.

Length-match your traces to within 100 mils. Or is it 10 mils? Or should you go down to 1 mil? Should you include the lengths of the vias? How about the lengths of resistors? Understanding the origin of length-matching requirements, coupled with some rudimentary signal integrity analysis, can help answer these questions.   Determining length requirements requires an understanding of flight time, electrical length vs. physical length, loading and signal quality. Those elements are vital in determining what the length really needs to be, as well as in determining the allowable trade-offs to meet system timing goals.