Electronic Everything!

Just as photographic film was mostly replaced by silicon image chips, now quantum film threats to replace the conventional CMOS image sensors in digital cameras. Made from materials similar to conventional film—a polymer with embedded particles—instead of silver grains like photographic film the embedded particles are quantum dots. Quantum films can image scenes with more pixel resolution, according to their inventors, InVisage Inc., offering four-times better sensitivity for ultra-high resolution sensors that are cheaper to manufacture.

A product can be of low quality for several reasons, such as it was shoddily manufactured, its components were improperly designed, its architecture was poorly conceived, and the product's requirements were poorly understood. Quality must be designed in. You can't test out enough bugs to deliver a high-quality product. The quality assurance (QA) process is vital for the delivery of a satisfactory system. In this last part in this series, we will concentrate on portions of the methodology particularly aimed at improving the quality of the resulting system. The software testing techniques described earlier in this series constitute one component of quality assurance, but the pursuit of quality extends throughout the design flow. For example, settling on the proper requirements and specification cannot be overlooked as an important determinant of quality. If the system is too difficult to design, it will probably be difficult to keep it working properly.

In a recent video, Willow Garage researcher Eitan Marder-Eppstein describes the open-source navigation stack they've released as version 1.0. The code, available at http://ros.org/wiki/navigation, was designed to be flexible and cross-platform, he says, and could be used in anything from a small iRobot Create-based bot to a large multi-sensor robot like Willow's own PR2 (which Spectrum has covered in detail here and here).

It’s 2020, and it’s sunny outside. In fact, it’s so bright in your kitchen that you have to squint to see your grapefruit. You flip on your e-reader and the most recent e-issue of IEEE Spectrum pops up on-screen, the colors and text sharp and brilliant in the sunlight. There’s e-mail to answer, but you want to make the early commuter bus, so you roll up your e-reader and stuff it in your jacket pocket.

In 2008 a team of physicists from Argonne National Laboratory, in Illinois, and other institutions stumbled upon an odd phenomenon. They called it superinsulation, because in many ways it was the opposite of superconductivity. Now they’ve worked out the theory behind it, potentially opening the doors to better batteries, supersensitive sensors, and strange new circuits. Superconductors lose all resistance once they fall below a certain temperature. In superinsulators, on the other hand, the resistance to the flow of electricity becomes infinite at very low temperatures, preventing any flow of electric current.

Experimental microbial fuel cells could turn bacteria into batteries that generate electricity from biomass. The key to this technology is the ability of bacteria to transfer electrons to their surroundings—for example, to the anode of a microbial fuel cell. But if the organisms have to be in direct contact with the anode, such devices would have to have extremely large surface areas. Researchers from Aarhus University, in Denmark, report today in the journal Nature that bacteria appear to conduct electricity while separated by several millimeters, at least a thousand times as far apart than previously demonstrated. The naturally occurring electric currents, if confirmed, would allow bacteria spaced at least 12 millimeters apart to communicate electrically. The discovery might lead to new paths to treating infection and a better understanding of microbial ecosystems.

The race to create tiny wireless sensors that could monitor anything from pressure in the eyes and brain to the stability of bridges appears to be heating up. Earlier this month, IEEE Spectrum reported on two approaches to creating an almost-indefinitely-running sensor using piezoelectric systems to convert tiny vibrations into power. Now, another team from the University of Michigan has created an alternative approach that uses solar power to keep the sensor running autonomously for many years.

Three-dimensional microchip designs are making their way to market to help pack more transistors on a chip as traditional scaling slows down. By stacking logic chips on top of one another other or combining logic chips with memory or RF with logic, chipmakers hope to sidestep Moore's Law, increasing the functionality of smartphones and other gadgets not by shrinking a chip's transistors but the distance between them. "There's a big demand for smaller packages in the consumer market, especially for the footprint of a mobile phone, or for improving the memory bandwidth of your GPU," says Pol Marchal, a principal scientist of 3-D integration at European microelectronics R&D center Imec. On 9 February, at the IEEE International Solid-State Circuits Conference (ISSCC), in San Francisco, Imec engineers presented some key design challenges facing 3-D chips made by stacking layers of silicon circuits using vertical copper interconnects called through-silicon vias (TSVs). These design constraints will have to be dealt with before TSVs can be widely used in advanced microchip architectures, Marchal says.

A little more than a week after long-simmering programmable logic startup Tabula Inc. emerged from stealth mode, Tier Logic Inc. stepped into the light Wednesday (March 10), offering the first details about its technology, which employs a novel processing change to build FPGA and ASIC products on a single die. Like Tabula, Tier Logic's technology depends on a three-dimensional structure. But while Tabula uses rapid reconfiguration to, in the words of that firm's executives, treat time as the third dimension, Tier Logic's approach separates user circuits and configuration circuits into 3-D stacked layers, creating what the company calls the world's first monolithic 3-D FPGA.

This API provides users with a standard FPGA communication interface from C++ code. It is intended to encourage more widespread adoption of FPGAs and reconfigurable computing platforms—particularly among Windows application developers

When considering the resolution required for an A/D converter (ADC) integrated in a microcontroller (MCU), embedded systems designers must balance cost and performance. Higher ADC resolution implies higher-cost MCUs, but in some cases you can use other features in the MCU to enhance the ADC performance via software. That approach lets you achieve higher resolution using an inexpensive integrated ADC. Here's how to use of oversampling to achieve extra bits of resolution for an ADC integrated in an MCU.

You just built a breadboard of your expert design. You did all the simulations needed before going to layout, and reviewed the manufacturer's suggested techniques for a good thermal design for the particular package chosen. You even did your due diligence in going through the initial thermal analysis equations on paper to be sure not to exceed IC junction temperatures with a comfortable margin. But wait, you turn on the power and the IC is pretty hot to the touch. You are uncomfortable with this (not to mention the concern of your thermal experts and reliability people). Now what do you do?

Ted Marena of Lattice Semiconductor Corp., points out that designers of digital systems are familiar with implementing the 'leftovers' of their digital design by using FPGAs and CPLDs to glue together various processors, memories, and standard function components on their printed circuit board. In addition to these digital functions, FPGAs and CPLDs can also implement common analog functions using an LVDS input, a simple resistor capacitor (RC) circuit and some FPGA or CPLD digital logic elements to create an analog to digital converter (ADC).

While the new multicore system on chip (SoC) signal-processing architecture announced by Texas Instruments this week at Mobile World Congress hits all the right notes with respect to what's needed in next-generation basestation designs, it rings a bit hollow given how sketchy the architectural details remain when contrasted with more 'real' announcements from the likes of Freescale. For sure, the requirements of next-generation basestations will push all architectures to their limits and beyond. Balancing lower power and lower cost with increasingly parallel, math-intensive processing to meet multiuser demands for high-data-rate data in 3GPP Long Term Evolution (LTE) Release 8 all-IP networks is not going to be easy, especially with the introduction of MIMO, beam forming, OFDMA and many other enhancements engineered to maximize spectral efficiency.

The main goal of this article is to focus on the difficulties encountered by SoC integrators when selecting an embedded microcontroller (MCU). Indeed, the selection is based on MCU performances, but the comparison can be difficult and compromised when considering all the parameters influencing these performances.In this article, we will detail how to assess rigorously power consumption, area, speed, code density and processing power for an embedded MCU. For each performance, we will describe how the parameters have to be selected to enable a fair comparison between processor cores.

Supporting the Wind River Systems VxWorks operating system on Intel architecture is valuable for customers who would like to preserve their application software and evaluate other architectures for comparison purposes or for architecture conversion. Products from Wind River Systems, particularly VxWorks, offer a great opportunity to address multiple architectures with the same real-time operating system (RTOS). Furthermore, the continuous development and migration of multicore platforms has increased the focus on migrating software to multicore and performance optimizations given a specified software workload and certain hardware resources.

DMA is used in almost every complex system or subsystems, but it's observed that teams either build the DMA controller from scratch for each project for specific application or take the existing DMAC available from elsewhere. This article discusses the architecture of DMAC that can be used with any kind of Bus, configuration (parallel, serial transfers), can be connected to any kind of ports, most importantly any kind of software assumptions can be implemented in the DMAC very easily.

The MiniZeni series from Sharp radiates high efficiency, deliver high color rendering index (CRI) values of up to 87 and boast a long service life whilst measuring only 15x12x1.6mm. The six new models of the MiniZeni series are characterised by four special features: they have compact outer dimensions and are extremely flat, economical and bright.

INTEL HELD AN EVENT in London last night to talk up its Core i3, i5 and i7 processors. To highlight the ceaseless march of technology and Chipzilla's own adherence to its beloved Moore's Law, the company was showcasing technology from the last 20 years as well as having a few demos about things we may expect to see in the future. Among these was this demonstration about the sorts of applications, such as advanced 3D rendering, that become feasible when a single processor can have 48 or more cores. µ