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In traditional short-haul microwave transmission (that is, line-of-sight microwave transmissions operating in the 18 GHz and 23 GHz radio bands),RF design engineers typically are concerned with signal aspects such as fade margins, signal reflections, multipath signals, and so forth. Like an accountant seeking to balance a financial spreadsheet, an RF design engineer normally creates an RF budget table, expressed in decibels (dB), in order to establish a wireless design. Aspects like transmit power and antenna gain are registered in the assets (or plus) column, and free space attenuation, antenna alignment, and atmospheric losses are noted in the liabilities (or minus) column. The goal is to achieve a positive net signal strength adequate to support the wireless path(s) called for in the design.

In addition to voice connectivity, digital cellular wireless networks such as GSM and its enhancement, GSM-EDGE, can now provide increased data speeds up to a (theoretical) limit of 384ﾠKbps. Third generation mobile networks, such as CDMA2000 and WCDMA or UMTS (Universal Mobile Telecommunications Standards) and TD-SCDMA (China only) are currently being deployed worldwide. These systems offer services such as video streaming, Internet browsing and, by using a technique called High Speed Packet Access (HSPA), they can in theory deliver downlink speeds up to 14,4 Mbps.

At three separate industry events last week, engineers said they are gearing up to deliver in 2011 chips that can handle serial data streams running at 25 Gbits/second to drive next-generation 100 and 400 Gbit/second networks. But they say it's still a mystery how—or if—they can deliver follow-on components for the terabit networks today's Internet data centers are already demanding. The kinds of jobs required to run today's Web 2.0 services such as Google and Facebook can completely overwhelm current 10 Gbit/s Ethernet links in the warehouse-sized data centers those companies use. Such data centers could use hundreds of 100 Gbit/s Ethernet links today, although standards for such networks are still being completed.

Related to the strong demands for virtualization technology, network I/O virtualization has recently become a hot topic and is one of the key topics being discussed at the upcoming Multicore Expo @ ESC. In fact, analyst firm IDC, in a recent white paper titled "Optimizing I/O Virtualization: Preparing the Data Center for Next-Generation Applications", stated that "If I/O is not sufficient, then it could limit all the gains brought about by the virtualization process."

Synopsys, Inc., has unveiled the DesignWare Ethernet Quality-of-Service (QoS) Controller IP which implements the new IEEE specifications for audio video bridging (AVB) features. The DesignWare Ethernet IP solution supports the new IEEE 802.1AS and 802.1-Qav version D6.0 specifications. These specifications enable efficient networking of streaming audio video (AV) applications through IEEE 802.1 networks found in consumer electronics, automotive AV and professional sound system products. Synopsys' DesignWare Ethernet QoS Controller, which supports 10/100/1G data transfer speeds, allows designers to develop system-on-chips (SoCs) that deliver time-synchronized, low-latency audio and video over Ethernet networks with exceptional quality-of-service while retaining compatibility with legacy networks.

Experimental microbial fuel cells could turn bacteria into batteries that generate electricity from biomass. The key to this technology is the ability of bacteria to transfer electrons to their surroundings—for example, to the anode of a microbial fuel cell. But if the organisms have to be in direct contact with the anode, such devices would have to have extremely large surface areas. Researchers from Aarhus University, in Denmark, report today in the journal Nature that bacteria appear to conduct electricity while separated by several millimeters, at least a thousand times as far apart than previously demonstrated. The naturally occurring electric currents, if confirmed, would allow bacteria spaced at least 12 millimeters apart to communicate electrically. The discovery might lead to new paths to treating infection and a better understanding of microbial ecosystems.

In separate keynote addresses in Silicon Valley, two Internet pioneers gave different takes on the future of the network of networks Monday (May 24). Vint Cerf, co-developer of the Net's TCP/IP protocol, shared his thoughts with developers of the smart electric grid, seen as a massive embedded extension to the Internet. Larry Roberts, who helped launch the forerunner of the Internet, explained his ideas for remedying the growing congestion that plagues the Web today. Smart grid developers can learn from the lessons of the Internet, Cerf told attendees at Connectivity Week here. They should follow the model of the Net in creating a layered architecture with plenty of room for flexibility in areas that cannot be anticipated today, he said in a keynote at Connectivity Week.

The MAX13171E along with the MAX13173E/ MAX13175E, form a complete pin-selectable data terminal equipment (DTE) or data communication equipment (DCE) interface port that support the V.28 (RS-232), V.10/V.11 (RS-449/V.36, RS-530, RS-530A, X.21), and V.35 protocols. The MAX13171E transceivers carry the high-speed clock and data signals, while the MAX13173E transceivers carry the control signals. The MAX13171E can be terminated by the MAX13175E pin-selectable resistor termination network. The MAX13175E contains six pin-selectable, multiprotocol cable termination networks.

When the Arduino Duemilanove microcontroller appeared in 2005, it featured a set of female pin headers exposing most of the pins of the ATmega168 for easy hacking and for connecting accessory boards known as 'Shields'. The purpose of a shield is to provide new plug-and-play functionality to the host microcontroller, such as circuit prototyping, motion control, sensor integration, network and radio communication, or gaming interfaces, without worrying too much about the hardware implementation details. Seven years after the birth of the original Arduino, new shields keep coming out and are being cataloged on http://shieldlist.org/, a testament to the versatility of the design. It is also simple to build a DIY shield when nothing out there will meet your needs or when you want to understand how the shield concept works from the ground up.

Ozmo Devices, the leading provider of low-power Wi-Fi Personal Area Network (Wi-Fi PAN) solutions, announced today that it started sampling its OZMO2000 chip to select peripheral manufacturers.  This is the first Wi-Fi solution to overcome the battery life, cost and compatibility issues that have limited the broad adoption of Wi-Fi for HID (human interface device) applications.  The OZMO2000 is currently available for use in Wi-Fi mouse, keyboard and remote control designs.  Furthermore, the solution is compatible with all Wi-Fi-enabled notebooks and desktops that are compatible with Windows 7.

Events such as natural disasters, military actions, and public safety threats have led to an increased need for robust robots — especially ones that can travel across complex terrain in any dimension. The ability to scale vertical building surfaces or other structures offers unique capabilities in military applications such as urban reconnaissance, sensor deployment, and setting up urban network nodes. SRI's novel clamping technology, called compliant electroadhesion, has enabled the first application of this technology to wall-climbing robots that can help with these situations.  As the name implies, electroadhesion is an electrically controllable adhesion technology. It involves inducing electrostatic charges on a wall substrate using a power supply connected to compliant pads situated on the moving robot. SRI has demonstrated robust clamping to common building materials including glass, wood, metal, concrete, etc. with clamping pressures in the range of 0.5 to 1.5 N per square cm of clamp (0.8 to 2.3 pounds per square inch). The technology works on conductive and non-conductive substrates, smooth or rough materials, and through dust and debris. Unlike conventional adhesives or dry adhesives, the electroadhesion can be modulated or turned off for mobility or cleaning. The technology uses a very small amount of power (on the order of 20 microwatts/Newton weight held) and shows the ability to repeatably clamp to wall substrates that are heavily covered in dust or other debris.

The IEEE has launched a new Web site that consolidates information about smart electric grids from it various societies. The portal is one of many activities from an IEEE smart grid initiative coordinating the organization's work on the transition to digital, networked power systems and services. The smart grid is "so interdisciplinary," said Wanda Reder, chair of the IEEE Smart Grid Task Force and former president of the IEEE Power & Energy Society. "We have the gamut covered in technical interests, but we needed a way to facilitate communications between our many entities to link information on all the conferences, papers and standards we have in this area," she added.

While the new multicore system on chip (SoC) signal-processing architecture announced by Texas Instruments this week at Mobile World Congress hits all the right notes with respect to what's needed in next-generation basestation designs, it rings a bit hollow given how sketchy the architectural details remain when contrasted with more 'real' announcements from the likes of Freescale. For sure, the requirements of next-generation basestations will push all architectures to their limits and beyond. Balancing lower power and lower cost with increasingly parallel, math-intensive processing to meet multiuser demands for high-data-rate data in 3GPP Long Term Evolution (LTE) Release 8 all-IP networks is not going to be easy, especially with the introduction of MIMO, beam forming, OFDMA and many other enhancements engineered to maximize spectral efficiency.

Predicting trends is difficult even by the most connected industry experts, but one trend that's easy to spot is the widespread acceptance of multicore SoC. This is happening for a number of reasons. First, it's been years since the workstation first adopted the multicore processor architecture to solve such issues as increasing performance and power concerns. While the adoption rate in workstations is now saturated and is fully supported by General Purpose OSs (GPOS), the embedded world is just now looking at ways to adopt multicore architecture. Second, several SoC vendors have been providing multicore solutions including Cavium, Freescale, MIPS, and ARM; but up until now, these solutions have been limited to networking and used for performance enhancements rather than for low power. The rest of the embedded industry has had limited hardware options available as low-power design is a driving factor. While the ARM 11 MPCore was ahead of its time, the Cortex-A9 MPCore design is ready for primetime and is gaining acceptance in the embedded marketplace. As a result, SoC vendors have adopted the Cortex-A9 MPCore hardware as a basis for their next generation designs. Over a year ago, Texas Instruments pre-announced their next-generation OMAP designs in the OMAP 4 with a dual-core Cortex-A9 MPCore, scheduled for production in the second-half of 2010. ST Microsystems has pre-announced their next generation consumer devices which will be based on the Cortex A9 MPCore.

Let’s face it. Most of the gear you use at work or play has multicore processors in it. Your laptop has them (the CPU itself has two cores, and the dedicated graphics processor has many more). That game console in the living room has still more, and even a high-end smartphone typically has a CPU and graphics core on a single chip. Out of sight but definitely not out of mind–particularly if they cease working–are the servers and high-throughput network routers, all which have numerous multicore processors in them. The multiple cores in these devices work in concert to provide quick responses to user queries or to manage the smooth flow of data throughout the office.