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Synopsys, Inc., has unveiled the DesignWare Ethernet Quality-of-Service (QoS) Controller IP which implements the new IEEE specifications for audio video bridging (AVB) features. The DesignWare Ethernet IP solution supports the new IEEE 802.1AS and 802.1-Qav version D6.0 specifications. These specifications enable efficient networking of streaming audio video (AV) applications through IEEE 802.1 networks found in consumer electronics, automotive AV and professional sound system products. Synopsys' DesignWare Ethernet QoS Controller, which supports 10/100/1G data transfer speeds, allows designers to develop system-on-chips (SoCs) that deliver time-synchronized, low-latency audio and video over Ethernet networks with exceptional quality-of-service while retaining compatibility with legacy networks.

In separate keynote addresses in Silicon Valley, two Internet pioneers gave different takes on the future of the network of networks Monday (May 24). Vint Cerf, co-developer of the Net's TCP/IP protocol, shared his thoughts with developers of the smart electric grid, seen as a massive embedded extension to the Internet. Larry Roberts, who helped launch the forerunner of the Internet, explained his ideas for remedying the growing congestion that plagues the Web today. Smart grid developers can learn from the lessons of the Internet, Cerf told attendees at Connectivity Week here. They should follow the model of the Net in creating a layered architecture with plenty of room for flexibility in areas that cannot be anticipated today, he said in a keynote at Connectivity Week.

While the new multicore system on chip (SoC) signal-processing architecture announced by Texas Instruments this week at Mobile World Congress hits all the right notes with respect to what's needed in next-generation basestation designs, it rings a bit hollow given how sketchy the architectural details remain when contrasted with more 'real' announcements from the likes of Freescale. For sure, the requirements of next-generation basestations will push all architectures to their limits and beyond. Balancing lower power and lower cost with increasingly parallel, math-intensive processing to meet multiuser demands for high-data-rate data in 3GPP Long Term Evolution (LTE) Release 8 all-IP networks is not going to be easy, especially with the introduction of MIMO, beam forming, OFDMA and many other enhancements engineered to maximize spectral efficiency.

The FPGAs referenced in these articles have complex dedicated I/O circuitries that are primarily designed to support external memory interfaces. The ALTMEMPHY megafunction is designed to support the most common memory standards, such as the DDR and DDR 2 SDRAM and QDR II+/QDR II SRAM (in a burst length of 4) interfaces. The ALTMEMPHY megafunction should be used whenever possible as it is beneficial to use the IP and timing closure methodologies used with these FPGAs, which enables users not to have to create this function manually as compared with using the ALTDLL and ALTDQ_DQS solution. However, the ALTMEMPHY megafunction does not support other external memory standards such as Mobile DDR, QDR II+/QDR II SRAM (in burst length of 2) or customized DDR and DDR 2 SDRAM external memory standards. For these scenarios, use the ALTDLL and ALTDQ_DQS megafunctions to access the FPGA architecture and build a custom external memory interface.

Anyone can bake a cake, but while some chefs bake dry, uninspired bricks of dough, there are other chefs who make cakes we would die for. The ingredients may be the same, but the outcomes are so very different. This is also the case between average electronic products and world-class, market-changing products. One of the most recent technical sensations is the capacitive touch screen. But what makes some touch screen-based products amazing, while others get such poor reviews?

Intel has announced that is developing a system-on-chip for embedded applications based around its Atom processor core. However, it appears the SoC will be of a fixed design with a PCI Express bus interface to which system-level customers can attach their own or third-party chips. Similarly it appears that Intel will manufacture the system-chip internally rather than allowing a foundry to make the chip, or add its customers' IP to the design. Doug Davis, corporate vice president and general manager of Intel's embedded and communications group, disclosed details of the "Tunnel Creek" SoC during his keynote speech on Wednesday (April 14) at the Intel Developer Forum, in Beijing China.