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Three-dimensional microchip designs are making their way to market to help pack more transistors on a chip as traditional scaling slows down. By stacking logic chips on top of one another other or combining logic chips with memory or RF with logic, chipmakers hope to sidestep Moore's Law, increasing the functionality of smartphones and other gadgets not by shrinking a chip's transistors but the distance between them. "There's a big demand for smaller packages in the consumer market, especially for the footprint of a mobile phone, or for improving the memory bandwidth of your GPU," says Pol Marchal, a principal scientist of 3-D integration at European microelectronics R&D center Imec. On 9 February, at the IEEE International Solid-State Circuits Conference (ISSCC), in San Francisco, Imec engineers presented some key design challenges facing 3-D chips made by stacking layers of silicon circuits using vertical copper interconnects called through-silicon vias (TSVs). These design constraints will have to be dealt with before TSVs can be widely used in advanced microchip architectures, Marchal says.

The marriage of high performance optics with microfluidics could prove the perfect match for making lab-on-a-chip technologies more practical. Microfluidics, the ability to manipulate tiny volumes of liquid, is at the heart of many lab-on-a-chip devices. Such platforms can automatically mix and filter chemicals, making them ideal for disease detection and environmental sensing. The performance of these devices, however, is typically inferior to larger scale laboratory equipment. While lab-on-a-chip systems can deliver and manipulate millions of liquid drops, there is not an equally scalable and efficient way to detect the activity, such as biological reactions, within the drops.

Intel has announced that is developing a system-on-chip for embedded applications based around its Atom processor core. However, it appears the SoC will be of a fixed design with a PCI Express bus interface to which system-level customers can attach their own or third-party chips. Similarly it appears that Intel will manufacture the system-chip internally rather than allowing a foundry to make the chip, or add its customers' IP to the design. Doug Davis, corporate vice president and general manager of Intel's embedded and communications group, disclosed details of the "Tunnel Creek" SoC during his keynote speech on Wednesday (April 14) at the Intel Developer Forum, in Beijing China.

A new chink has been found in the cryptographic armor that protects bank transactions, credit-card payments, and other secure Internet traffic. And although programmers have devised a patch for it, clever hackers might still be able to break through. The hack, presented in March at a computer security conference in Dresden, Germany, involves lowering the input voltage on a computer’s cryptography chip set and collecting the errors that leak out when the power-starved chips try and (sometimes) fail to encode messages. Crooks would then use those errors to reconstruct the secret key on which the encryption is based. More important, say the hack’s creators, the same attack could also be performed from afar on stressed systems, such as computer motherboards that run too hot or Web servers that run too fast.

At three separate industry events last week, engineers said they are gearing up to deliver in 2011 chips that can handle serial data streams running at 25 Gbits/second to drive next-generation 100 and 400 Gbit/second networks. But they say it's still a mystery how—or if—they can deliver follow-on components for the terabit networks today's Internet data centers are already demanding. The kinds of jobs required to run today's Web 2.0 services such as Google and Facebook can completely overwhelm current 10 Gbit/s Ethernet links in the warehouse-sized data centers those companies use. Such data centers could use hundreds of 100 Gbit/s Ethernet links today, although standards for such networks are still being completed.

While the new multicore system on chip (SoC) signal-processing architecture announced by Texas Instruments this week at Mobile World Congress hits all the right notes with respect to what's needed in next-generation basestation designs, it rings a bit hollow given how sketchy the architectural details remain when contrasted with more 'real' announcements from the likes of Freescale. For sure, the requirements of next-generation basestations will push all architectures to their limits and beyond. Balancing lower power and lower cost with increasingly parallel, math-intensive processing to meet multiuser demands for high-data-rate data in 3GPP Long Term Evolution (LTE) Release 8 all-IP networks is not going to be easy, especially with the introduction of MIMO, beam forming, OFDMA and many other enhancements engineered to maximize spectral efficiency.

Just as photographic film was mostly replaced by silicon image chips, now quantum film threats to replace the conventional CMOS image sensors in digital cameras. Made from materials similar to conventional film—a polymer with embedded particles—instead of silver grains like photographic film the embedded particles are quantum dots. Quantum films can image scenes with more pixel resolution, according to their inventors, InVisage Inc., offering four-times better sensitivity for ultra-high resolution sensors that are cheaper to manufacture.

I remember when, a decade ago, Kevin Warwick, a professor at the University of Reading, in the U.K., implanted a radio chip in his own arm. The feat caused quite a stir. The implant allowed him to operate doors, lights, and computers without touching anything. On a second version of the project he could even control an electric wheelchair and produce artificial sensations in his brain using the implanted chip. Warwick had become, in his own words, a cyborg. The idea of a cyborg -- a human-machine hybrid -- is common in science fiction and although the term dates back to the 1960s it still generates a lot of curiosity. I often hear people asking, When will we become cyborgs? When will humans and machines merge? Although some researchers might have specific time frames in mind, I think a better answer is: It's already happening. When we look back at the history of technology, we tend to see distinct periods -- before the PC and after the PC, before the Internet and after the Internet, and so forth -- but in reality most technological advances unfold slowly and gradually. That's particularly true with the technologies that are allowing us to modify and enhance our bodies.

It is no secret that field-programmable gate arrays (FPGAs) are getting bigger and more complex all the time. The fabrication process creates smaller transistors and makes more dense chips packing more digital processing per nanometer. Engineers love to see advancement because it means they can do more with modern silicon, and many times NI LabVIEW FPGA Module technology helps by abstracting the complexity to a higher level so that engineers can more smoothly take advantage of these improvements.  Unfortunately, there is one issue with FPGAs that continues to be a time sink and only gets worse with denser FPGAs: compilation time.

Ozmo Devices, the leading provider of low-power Wi-Fi Personal Area Network (Wi-Fi PAN) solutions, announced today that it started sampling its OZMO2000 chip to select peripheral manufacturers.  This is the first Wi-Fi solution to overcome the battery life, cost and compatibility issues that have limited the broad adoption of Wi-Fi for HID (human interface device) applications.  The OZMO2000 is currently available for use in Wi-Fi mouse, keyboard and remote control designs.  Furthermore, the solution is compatible with all Wi-Fi-enabled notebooks and desktops that are compatible with Windows 7.

Single-walled carbon nanotube (SWCNT)-based thin film transistors (TFTs) could be at the core of next-generation flexible electronics – displays, electronic circuits, sensors, memory chips, and other applications that are transitioning from rigid substrates, such as silicon and glass, to flexible substrates. What's holding back commercial applications is that industrial-type manufacturing of large scale SWCNT-based nanoelectronic devices isn't practical yet because controlling the morphology of single-walled carbon nanotubes is still causing headaches for materials engineers.

PC-compatible industrial computers are increasing in computing power at a rapid rate due to the availability of multi-core microprocessor chips, and Microsoft Windows has become the de-facto software platform for implementing human-machine interfaces (HMIs). PCs are also becoming more reliable. With these trends, the practice of building robotic systems as complex multi-architecture, multi-platform systems is being challenged. It is now becoming possible to integrate all the functions of machine control and HMI into a single platform, without sacrificing performance and reliability of processing. Through new developments in software, we are seeing industrial systems evolving to better integrate Windows with real-time functionality such as machine vision and motion control. Software support to simplify motion control algorithm implementation already exists for the Intel processor architecture.

In case you haven’t realized it, the new trend in computer chip technology is multi-core. This is where most of the speed improvements moving forward will come from on our computers. To take full advantage of this however it is necessary to design your applications using Parallel Programming practices, also known as "parallelism". In today’s episode, we will meet with Stephen Toub, who will share with us some of the overarching concepts associated with parallelism, and some of the ways we are trying to empower developers to develop applications to take advantage of it.

The first part of this white paper explores the basic concepts behind HDMI, the markets it serves and its leadership role in multimedia interfaces. This is followed by a tutorial on the new capabilities of HDMI 1.4 and their role in providing a richer, more straightforward user experience. Next, we'll explore a series of user case scenarios that illustrate how the HEAC feature can simplify cabling requirements between digital home multimedia devices. The last portion of this paper discusses the architectural considerations and technical details involved with incorporating the Ethernet and Sony/Philips Digital Interconnect Format (S/PDIF) standards into the HDMI system-on-chips (SoCs) to support the HEAC feature.

Cypress Semiconductor Corp. has launched a programmable product for data communication over existing power lines. The Powerline Communication product leverages the programmable analog and digital resources of Cypress's PSoC programmable system-on-a-chip architecture. It integrates multiple functions beyond communication, such as power measurement, system management and LCD drive. In addition to its flexibility and integration, the product offers greater than 97% packet success rates without retries and 100% success rates with retries built into the solution's coding, according to Cypress. It also offers the flexibility to communicate over high-voltage and low-voltage power lines for lighting and industrial control, home automation, automatic meter reading and smart energy management applications.

NXP BV (Eindhoven, The Netherlands) has said it will demonstrate a microcontroller based on the ARM Cortex-M4 at the Embedded Systems Conference in San Jose, California. NXP was one of the first companies to license the Cortex-M4 processor core and a chip has been implemented using a low-leakage 90-nm process technology. This enables performance in excess of 150-MHz clock frequency, NXP said. NXP has added proprietary power-down techniques to reduce power consumption. The ESC Silicon Valley demo will show that a 7-channel audio graphic equalizer application processing 32-bit precision audio data requires only 12 MHz of CPU bandwidth using the Cortex-M4 DSP extensions, and 60 MIPs without. The core includes DSP extensions not usually found inside a microcontroller and NXP's implementation are aimed at a broad set of applications including motor control, digital power control and embedded audio.

We've collected the most recent how-to and technical articles from Embedded.com on multithreading, multicores, multiprocessor-on-chip (MPoc), and multiprocessor system designs. We're constantly updating our lists of articles and industry links. Keep checking back to see what's new.