Specs that see right through you [05Jul11] - 0 views
-
Boring conversation? Accessories that decipher emotional cues could save your social life – or reveal that you're a jerk
-
The glasses can send me this information thanks to a built-in camera linked to software that analyses Picard's facial expressions. They're just one example of a number of "social X-ray specs" that are set to transform how we interact with each other. By sensing emotions that we would otherwise miss, these technologies can thwart disastrous social gaffes and help us understand each other better. Some companies are already wiring up their employees with the technology, to help them improve how they communicate with customers. Our emotional intelligence is about to be boosted, but are we ready to broadcast feelings we might rather keep private?
-
Some of our body's responses during a conversation are not designed for broadcast to another person - but it's possible to monitor those too. Your temperature and skin conductance can also reveal secrets about your emotional state, and Picard can tap them with a glove-like device called the Q Sensor. In response to stresses, good or bad, our skin becomes clammy, increasing its conductance, and the Q Sensor picks this up.
- ...2 more annotations...
-
In a 10-day experiment in 2008, Japanese and American college students were given the task of building a complex contraption while wearing the next generation of jerk-o-meter - which by that time had been more diplomatically renamed a "sociometric badge". As well as audio, their badge measured proximity to other people.
-
Physiological responses can now even be tracked remotely, in principle without your consent. Last year, Picard and one of her graduate students showed that it was possible to measure heart rate without any surface contact with the body. They used software linked to an ordinary webcam to read information about heart rate, blood pressure and skin temperature based on, among other things, colour changes in the subject's face (Optics Express, vol 18, p 10762).