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Multisim 11 is the latest version of its circuit simulation software, with specialized editions for both hands-on learning and professional circuit design. The easy-to-use Multisim software delivers a graphical approach that abstracts the complexities of traditional circuit simulation, helping educators, students and engineers employ advanced circuit analysis technology. The academic edition of Multisim 11 incorporates specialized teaching features and is complemented by circuits textbooks and courseware. This integrated system helps educators engage students and reinforce circuit theory with an interactive, hands-on approach to investigating circuit behavior. Multisim 11 Professional helps engineers optimize circuit designs, minimize errors and reduce prototype iterations. When combined with the new NI Ultiboard 11 layout and routing software, Multisim provides engineers a cost-effective, end-to-end prototyping platform. Its integration with NI LabVIEW measurement software also helps engineers define custom analyses to improve design validation…

You just built a breadboard of your expert design. You did all the simulations needed before going to layout, and reviewed the manufacturer's suggested techniques for a good thermal design for the particular package chosen. You even did your due diligence in going through the initial thermal analysis equations on paper to be sure not to exceed IC junction temperatures with a comfortable margin. But wait, you turn on the power and the IC is pretty hot to the touch. You are uncomfortable with this (not to mention the concern of your thermal experts and reliability people). Now what do you do?