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A product can be of low quality for several reasons, such as it was shoddily manufactured, its components were improperly designed, its architecture was poorly conceived, and the product's requirements were poorly understood. Quality must be designed in. You can't test out enough bugs to deliver a high-quality product. The quality assurance (QA) process is vital for the delivery of a satisfactory system. In this last part in this series, we will concentrate on portions of the methodology particularly aimed at improving the quality of the resulting system. The software testing techniques described earlier in this series constitute one component of quality assurance, but the pursuit of quality extends throughout the design flow. For example, settling on the proper requirements and specification cannot be overlooked as an important determinant of quality. If the system is too difficult to design, it will probably be difficult to keep it working properly.

Cypress Semiconductor Corp. has launched a programmable product for data communication over existing power lines. The Powerline Communication product leverages the programmable analog and digital resources of Cypress's PSoC programmable system-on-a-chip architecture. It integrates multiple functions beyond communication, such as power measurement, system management and LCD drive. In addition to its flexibility and integration, the product offers greater than 97% packet success rates without retries and 100% success rates with retries built into the solution's coding, according to Cypress. It also offers the flexibility to communicate over high-voltage and low-voltage power lines for lighting and industrial control, home automation, automatic meter reading and smart energy management applications.

Three-dimensional microchip designs are making their way to market to help pack more transistors on a chip as traditional scaling slows down. By stacking logic chips on top of one another other or combining logic chips with memory or RF with logic, chipmakers hope to sidestep Moore's Law, increasing the functionality of smartphones and other gadgets not by shrinking a chip's transistors but the distance between them. "There's a big demand for smaller packages in the consumer market, especially for the footprint of a mobile phone, or for improving the memory bandwidth of your GPU," says Pol Marchal, a principal scientist of 3-D integration at European microelectronics R&D center Imec. On 9 February, at the IEEE International Solid-State Circuits Conference (ISSCC), in San Francisco, Imec engineers presented some key design challenges facing 3-D chips made by stacking layers of silicon circuits using vertical copper interconnects called through-silicon vias (TSVs). These design constraints will have to be dealt with before TSVs can be widely used in advanced microchip architectures, Marchal says.

The FPGAs referenced in these articles have complex dedicated I/O circuitries that are primarily designed to support external memory interfaces. The ALTMEMPHY megafunction is designed to support the most common memory standards, such as the DDR and DDR 2 SDRAM and QDR II+/QDR II SRAM (in a burst length of 4) interfaces. The ALTMEMPHY megafunction should be used whenever possible as it is beneficial to use the IP and timing closure methodologies used with these FPGAs, which enables users not to have to create this function manually as compared with using the ALTDLL and ALTDQ_DQS solution. However, the ALTMEMPHY megafunction does not support other external memory standards such as Mobile DDR, QDR II+/QDR II SRAM (in burst length of 2) or customized DDR and DDR 2 SDRAM external memory standards. For these scenarios, use the ALTDLL and ALTDQ_DQS megafunctions to access the FPGA architecture and build a custom external memory interface.

FPGAs referenced in this article have complex dedicated I/O circuitries that are primarily designed to support EMIF. The ALTMEMPHY megafunction is designed to support the most common memory standards, such as the DDR , DDR2 SDRAM, and QDR II+/QDR II SRAM (in a burst length of 4) interfaces. Other external memory standards such as Mobile DDR, QDR II+/QDR II SRAM (in burst length of 2), or customized DDR and DDR 2 SDRAM external memory standards are not supported. Instead, the ALTDLL and ALTDQ_DQS megafunctions are used to access the FPGA architecture and build a custom EMIF.

Today's FPGAs are doubling in capacity every 2 years and have already surpassed the 5 million equivalent ASIC gate mark. With designs of this magnitude, the need for fast flows has never been greater. At the same time, designers are seeking rapid feedback on their ASIC or FPGA designs by implementing quick prototypes or initial designs on FPGA-based boards. These prototypes or designs allow designers to start development, verification and debug of the design—in the context of system software and hardware—and also to fine tune algorithms in the design architecture. Quick and intuitive debug iterations to incorporate fixes are of great value. The ability to perform design updates that don't completely uproot all parts of the design that have already been verified is also a bonus! Whether the goal is aggressive performance or to get a working initial design or prototype on the board as quickly as possible, this paper provides information on traditional and new techniques that accelerate design and debug iterations.

Xilinx Inc. today introduced the architecture for a new Extensible Processing Platform they claim will deliver unrivaled levels of system performance, flexibility and integration to developers of a wide variety of embedded systems. The ARM Cortex-A9 MPCore processor-based platform enables system architects and embedded software developers to apply a combination of serial and parallel processing to address the challenges they face in designing today's embedded systems, which must meet ever-growing demands to perform highly complex functions. The Xilinx Extensible Processing Platform offers embedded systems designers a processor-centric design and development approach for achieving the compute and processing horsepower required to drive tasks involving high-speed access to real-time inputs, high-performance processing and complex digital signal processing - or any combination thereof - needed to meet their application-specific requirements, including lower cost and power.

A Product How-To on building a unified control environment using architectures such as TI’s Stellaris ARM Cortex-M3-based MCUs or Cortex-A8-based Sitara AM35x MPUs.