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Three-dimensional microchip designs are making their way to market to help pack more transistors on a chip as traditional scaling slows down. By stacking logic chips on top of one another other or combining logic chips with memory or RF with logic, chipmakers hope to sidestep Moore's Law, increasing the functionality of smartphones and other gadgets not by shrinking a chip's transistors but the distance between them. "There's a big demand for smaller packages in the consumer market, especially for the footprint of a mobile phone, or for improving the memory bandwidth of your GPU," says Pol Marchal, a principal scientist of 3-D integration at European microelectronics R&D center Imec. On 9 February, at the IEEE International Solid-State Circuits Conference (ISSCC), in San Francisco, Imec engineers presented some key design challenges facing 3-D chips made by stacking layers of silicon circuits using vertical copper interconnects called through-silicon vias (TSVs). These design constraints will have to be dealt with before TSVs can be widely used in advanced microchip architectures, Marchal says.

Analog Devices, Inc., has introduced a pair of Class-D audio amplifiers for smart phones, GPS units and other handheld electronics where premium sound quality offers a major competitive advantage. The SSM2375 and SSM2380 amplifiers provide audio system designers with the option of fixed or programmable gain settings combined with low noise and superior audio performance. The SSM2380 low-power, stereo Class-D amplifier is the first in its class to incorporate an I²C interface, which allows gain stages to be set from 1 dB to 24 dB (plus mute) in 47 distinct steps with no other external components required. The programmable interface also enables independent L/R channel shutdown, a variable low-EMI (electro-magnetic interference) emission control mode, and programmable ALC (automatic level control) functions for speaker protection. The SSM2380 achieves a 100-dB SNR (signal-to-noise ratio) and extends battery life by achieving 93 percent power efficiency at 5 V while running at 1.4 W into an 8-ohm speaker.

D-Wave Systems, which in 2009 partnered with Google to test a prototype quantum computer for detecting vehicles in images, announced that it has now sold the first commercial quantum computer. The D-Wave quantum computer, called Rainier, solves discrete optimization problems using quantum annealing. The computer was sold to Lockheed-Martin for an undisclosed price. It is supercooled, requires 15 kilowatts, and supports APIs in multiple programming environments including Python, Java, C++, SQL, and MATLAB.

DSP core licensor Ceva Inc. is due to unveil a software-programmable multimedia video processor architecture at the Mobile World Congress in Barcelona next week. The multicore architecture, called MM3000, which comes complete with C compilers, power management provision and an RTOS/multithreading scheduler is intended to be able to process any and all video codecs up to the highest resolutions and frame rates currently available as well as future codecs for things like 3-D video.

A little more than a week after long-simmering programmable logic startup Tabula Inc. emerged from stealth mode, Tier Logic Inc. stepped into the light Wednesday (March 10), offering the first details about its technology, which employs a novel processing change to build FPGA and ASIC products on a single die. Like Tabula, Tier Logic's technology depends on a three-dimensional structure. But while Tabula uses rapid reconfiguration to, in the words of that firm's executives, treat time as the third dimension, Tier Logic's approach separates user circuits and configuration circuits into 3-D stacked layers, creating what the company calls the world's first monolithic 3-D FPGA.

A research project will be conducted this week in Linz, Austria, to discover what the ideal interaction between people and humanoid robots ought to be in the future, Honda R&D and Ars Electronica Futurelab announced today. The research, the first of its kind in Europe, will involve members of the public directly interacting with ASIMO, Honda's humanoid robot.

When considering the resolution required for an A/D converter (ADC) integrated in a microcontroller (MCU), embedded systems designers must balance cost and performance. Higher ADC resolution implies higher-cost MCUs, but in some cases you can use other features in the MCU to enhance the ADC performance via software. That approach lets you achieve higher resolution using an inexpensive integrated ADC. Here's how to use of oversampling to achieve extra bits of resolution for an ADC integrated in an MCU.