Group items tagged

Single Crystalline Silicon Ingot The primary application of these silicon materials is in the semiconductor/photovoltaic industry, specifically for manufacturing polycrystalline silicon ingots used in the production of silicon components or solar cells. We offer customization options for any size and shape of silicon materials, including but not limited to silicon tubes, rings, and wafers. Features of DSTC Single Crystal Ingot 1 Resistivity Control. 2 Manufacturability. 3 Devoted to developing large size pulling technique, DSTC is the 1st domestic manufacturer to supply >φ620mm silicon ingots. Single-Crystalline Silicon Ingot Gallery The biggest monocrystalline silicon ingot of OD 620mm in mass production succeeefully in the world. As a proficient silicon semiconductor company, DSTC has rapidly grown into a leader in the domestic semiconductor silicon components industry.

Silicon Parts Silicon Parts integrates silicon ingot growth, cutting, machining and cleaning to provide high-purity and particle-free silicon parts for 200mm and 300mm etchers. Silicon Parts Types Silicon Ring Silicon Electrode Why Choose Our Silicon Parts? The only manufacturer in China that can provide world-class full product family silicon components; One of the most advanced manufacturing R&D and material R&D laboratories in Chinese Mainland, and provides sample preparation, physical and chemical analysis and other testing services, product cleaning and renovation business.

Silicon Material The main products of SiMaterial series are MCZ/CZ monocrystalline silicon and CZ polycrystalline silicon, including semiconductor monocrystalline or polycrystalline silicon rods, silicon ingots, sheets, columnar crystals, which are mainly used for processing silicon components and high-purity silicon targets.

Silicon Susceptor The silicon carbide susceptor is utilized in semiconductor CVD and PVD machines to provide support for wafers during high-temperature processes, ensuring stability and preventing any potential damage caused by nitrogen flow or accidental dropping. Additionally, it can also be utilized as a wafer carrier in semiconductor etching equipment. Features of DSTC SIC Susceptor 1 The minimum thickness reaches 1mm; High purity; Recyclable and reusable. 2 Self-developed cleaning technology, the surface metal ion residue meets the requirements of silicon wafer treatment process. 3 Mature processing process. Silicon Susceptor Gallery The Silicon Susceptor is utilized for transporting the wafer. As one of silicon carbide semiconductor manufacturers, we will do our best to meet all the needs of customers.

Ring Silicon Made by single or multi-crystalline silicon ingot materials. The outside diameter is up to 650mm. The ring product is used in the dry etching machine as the focus ring, outer electrode, confinement ring. Features of DSTC Silicon Ring 1 Establishment of plasma etching condition. 2 Use as electrodes for RF units. 3 Control sidewall damage of the reactive substance, improve etching aspect ratios and optimize etching surfaces. 4 Improve the uniformity and yield of the edge of silicon wafer.

Silicon Pedestal The Silicon Pedestal is a pure silicone base product designed to ensure temperature stability in the thermal reaction tube during silicon wafer processing, thereby enhancing insulation efficiency. Silicon wafer processing is an extremely precise procedure where temperature plays a crucial role, directly impacting the thickness and uniformity of the silicon wafer film.

Silicon Injector The Silicon Injector is a crucial component in the heat treatment process and deposition of silicon wafers, directly impacting their heat treatment effectiveness and deopsition performance. Heat treatment of silicon wafers plays a vital role in semiconductor and integrated circuit processing, with its outcome closely tied to the final performance of the wafer.

Silicon Carbide Tubes In the LPCVD equipment, the sic tube is one of the cores of the entire equipment, with an inner tube and an outer tube. LPCVD equipment is a kind of CVD equipment, which generates solid reactants through chemical reaction of mixed gases under low pressure and high temperature conditions and deposits them on the surface of silicon wafers to form thin films.