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The semiconductor electrode from DSTC is utilized in dry etching equipment for the manufacturing of semiconductor integrated circuits. The silicon electrode serves as both the pathway for etching gas to enter the cavity and as an electrode to generate plasma, making it a crucial component in the wafer manufacturing etching process.

Ring Silicon Made by single or multi-crystalline silicon ingot materials. The outside diameter is up to 650mm. The ring product is used in the dry etching machine as the focus ring, outer electrode, confinement ring. Features of DSTC Silicon Ring 1 Establishment of plasma etching condition. 2 Use as electrodes for RF units. 3 Control sidewall damage of the reactive substance, improve etching aspect ratios and optimize etching surfaces. 4 Improve the uniformity and yield of the edge of silicon wafer.