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Mention copper to almost anyone in the PCB industry these days and the first thing that springs to mind is the ongoing price increase. Although copper pricing is not directly monitored by BPA, the impact on the price of laminate and PCBs is monitored through BPA's quarterly survey for its PCB Information Service. \n\nIn the short term, forecasted increases on the demand side for copper prices are likely to remain at least at the current level. The trend in copper usage has diverged in the fact that a number of different applications now exist. \n\nAt one time, 1 ounce (35µm) copper was standard, but the average is now 0.5 ounces. Using thinner copper, if the design will allow, can, to some extent, offset a price increase. However, one segment of the PCB industry which is particularly vulnerable to copper prices is the automotive sector, where recent developments have seen the introduction of thick copper PCBs for smart fuse boxes and power electronics. These boards use 4 ounce, 6 ounce and 10 ounce copper--up to 20 times the standard thickness.

Driven by the need for increased speed, portability and wiring density, the interconnect pitch on semiconductor packages, and the corresponding high density interconnect (HDI) substrates, continue to shrink. The combination of filled blind microvias and build-up technology provides a means to achieve the required wiring densities. With the rapid growth of this technology, the use of electrodeposited copper for filling blind microvias has become a widely adopted process for manufacture of both HDI printed circuit boards (PCBs) and also semiconductor package substrates.

Applied Nanotech Holdings Inc announced that its subsidiary, Applied Nanotech Inc (ANI), established a strategic development program with Optomec, Inc, a provider of printed electronics for solar, display, electronic packaging and flexible electronics applications. As a part of the commitment, ANI will install a dedicated Optomec M3D aerosol jet printer at its facilities in order to adapt its copper ink to Optomec's patented ultra high resolution printing technology. By utilizing ANI's copper ink, the Optomec printer will offer the solar, display, flexible circuit and PCB manufacturers contact-free deposition of high quality, low cost metal lines, the companies said. According to the companies, the Optomec printing solution is able to produce much finer lines than is currently possible with traditional screen printing and inkjet printing equipment. The combined ANI/Optomec copper ink printing solution will provide an alternative to silver inks facilitating lower cost, coupled with the promise of higher reliability. Furthermore, ANI's copper inks do not require expensive vacuum installation or inert gas environment lowering the cost of the capital for manufacturing equipment.

Rohm and Haas Company has reported second quarter 2008 sales of $2,567 million, a 17% increase over the same period in 2007, with Electronic Materials and the chemical businesses outside North America delivering strong growth. The Electronic Materials Group comprises two reportable segments which provide materials for use in applications such as telecommunications, consumer electronics and household appliances. Sales for the Electronic Materials Group were $536 million in the second quarter of 2008, up 34% over the same period in 2007, reflecting the impact of acquisitions in Display Technologies as well as solid organic growth of Electronic Technologies. The Electronic Technologies segment is comprised of the company's Semiconductor Technologies, Circuit Board Technologies and Packaging and Finishing Technologies business units. Sales for the segment of $460 million were up 16% versus the second quarter of 2007, driven by strong growth in Asia for all business units. Sales in the second quarter excluding precious metals pass-through sales were up 15%. Semiconductor Technologies sales grew 13%, reflecting strong demand and favorable currencies, particularly in the Asia Pacific Region. Circuit Board Technologies sales increased 20% as compared to the same period last year, with solid growth in the Asia Pacific Region more than offsetting declines in North America. Packaging and Finishing Technologies sales rose 20% versus last year, primarily driven by strong growth in precious metal sales and in process sales. Adjusted pre-tax earnings for this segment of $107 million were up 11% from the second quarter of 2007, reflecting increased demand and favorable currencies, partially offset by higher metal costs and increased costs related to expansion efforts, including the new Asia Technical Center in Taiwan.\n\n\n

Growth in Asia is illustrated from this reporting at multiple levels of business - Opportunities are available for copper in a multitude of applications.