You have cracked all the stages of the interview with flying colors. Now the company has called you for the final round - the salary negotiation round. How do you ensure that you get a good pay package without bowing out of the race for the job?
You have cracked all the stages of the interview with flying colors. Now the company has called you for the final round - the salary negotiation round. How do you ensure that you get a good pay package without bowing out of the race for the job?
Kuttanad is known as the Rice Bowl of Kerala, situated in Alleppey. This page describes regarding the Kuttanad tourism, Kuttanad Packages and Kuttanad Backwaters.
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
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