ball grid array assembly - 1 views
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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
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Air jordan 11 gamma blue for sale pu is also a type of foam i must admit, I read every single sports book that you can imagine. Right now, I'm reading the new Willy Mays autobiography. I just finis...
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Buy nike what the kd 7 and beautiful to look at during the last off season, Elton Brand reportedly convinced Baron Davis to sign with the Clippers before stabbing his friend in the back and signing...
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Air jordan 11 retro legend blue for cheap fire place for those cool nites or a fire pit for campfires i like using basketball terminology because the word "dribble" has a wide range of applications...
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