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These BGA rework stencils provided by Soldertools.net make it simpler for you to place BGAs while repairing solder mask damage. StencilQuik™ BGA rework stencils have a side benefit of being able to repair solder mask underneath the location as the polyimide is an elegant "band aid" for the repair of the damaged mask.

EZReball™ reballing preforms in lead free offered by BEST Inc Store used when the devices you want to place need to be lead free. EZReball™ BGA preforms are also manufactured as per your package requirements from a specialty high temperature-rated film which aligns the balls.

StencilQuik™ are flexible solder paste stencils manufactured from a polyimide film with a high temperature adhesive covered with a release liner. They allow you to simplify area array device placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.

This kit is specifically designed to make the repair process as simple and reliable as possible. All the tools and materials are packaged in a rugged ESD safe carrying case. All the tools and materials are neatly arranged. Every item is of prime quality, time-tested, to meet high standards of IPC.