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Bob Wettermann

EZReball™ Reballing Rework - Lead Free - BEST Inc - 0 views

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    EZReball™ reballing preforms in lead free offered by BEST Inc Store used when the devices you want to place need to be lead free. EZReball™ BGA preforms are also manufactured as per your package requirements from a specialty high temperature-rated film which aligns the balls.
Bob Wettermann

Universal BGA Repair Kit - StencilQuik(TM) - 0 views

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    StencilQuik™ are flexible solder paste stencils manufactured from a polyimide film with a high temperature adhesive covered with a release liner. They allow you to simplify area array device placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.
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