Group items tagged

These are heady times for the thin-film solar industry. The sector's dominant player, First Solar, has been on a tear of late, recently announcing it would build a second 10 megawatt power plant in Nevada, while Miasole, once thought to be ailing, has staged an impressive comeback, raking in an eye-popping $220 million. Nanosolar has developed a new ultra-fast solar cell printer, and even giants like IBM and Applied Materials have gotten in on the game. In the face of such intense competition, how will HelioVolt, a well-funded outpost of CIGS manufacturing in Texas, fare? The company hopes a new hybrid, super fast CIGS process it has developed in collaboration with the National Renewable Energy Laboratory (NREL), which combines its patented FASST process and NREL's non-vacuum deposition technique, will help even the odds. The Austin, Texas-based company licensed NREL's non-vacuum deposition process, which allows for the quick application of liquid precursors onto a printing plate and substrate, to manufacture its solar cells with a 12.2 percent conversion efficiency at a fraction of the regular cost and in record time - under 6 minutes. Another advantage is that the substrate can be made from a variety of building materials, including glass, metals, plastics and roofing materials.

Driven by the need for increased speed, portability and wiring density, the interconnect pitch on semiconductor packages, and the corresponding high density interconnect (HDI) substrates, continue to shrink. The combination of filled blind microvias and build-up technology provides a means to achieve the required wiring densities. With the rapid growth of this technology, the use of electrodeposited copper for filling blind microvias has become a widely adopted process for manufacture of both HDI printed circuit boards (PCBs) and also semiconductor package substrates.

"But if nature was forced to use the pipes-and-ion-channels approach, that leaves us with plenty of scope for speeding things up using silicon and copper (and this is quite apart from all the other more exotic computing substrates that are now on the horizon). If we were simply to make a transition membrane depolarization waves to silicon and copper, and if this produced a 1,000x speedup (a conservative estimate, given the intrinsic difference between the two forms of signalling), this would be an explosion worthy of the name."

"Prieto's first battery to market will be produced with a copper foam substrate."

ArcelorMittal (NYSE: MT), a steel manufacturer based in New Deli, launched a clean technology venture capital fund to support ventures that have relevance for the carbon-intensive steel industry. The Fund has made its first investment of US$20 million in Miasolé, a California-based pioneer in the development of thin-film solar panels Miasolé has developed unique high volume manufacturing processes that enable efficient production of Copper Indium Gallium Selenium (CIGS) solar products on a flexible stainless steel substrate. This technology promises to dramatically lowers the installed cost of Photovoltaic (PV) systems and will enable renewable energy from the sun to replace carbon generating fossil fuels. Fund managers will be working with leading venture capital firms, including Bessemer Venture Partners, Khosla Ventures, and Kleiner Perkins Caufield & Byers, to identify worthy cleantech ventures. ArcelorMittal also announced that it has created a new carbon fund in order to strategically engage in the carbon market and promote climate friendly solutions that are relevant for the steel industry. The fund, which has an initial investment commitment of €100 million (US$ 157 million) is currently looking at investment opportunities in renewable energy, energy efficiency, methane capture and greenhouse gas reducing technologies--all of which have the potential to generate carbon credits under the Kyoto Protocol. ArcelorMittal intends to use the carbon credits received from these Clean Development Mechanism and Joint Implementation projects for compliance in the EU Emissions Trading Scheme.

Printable electronics have taken off in recent years, and there are now industrial-scale printing machines that can efficiently deposit a variety of flexible electronic components onto flexible substrates to create wearable sensors, displays, smart packaging labels, and other printable products. However, developing printable, flexible energy-storage devices, such as supercapacitors and batteries has lagged behind.