Group items tagged

Super strong nanometals - a Chinese-Danish success Research shows that it is possible to produce copper about 4 times stronger than commercial material - and doing so while also having a ductile material. As the thermal and electrical conductivity are also good, the manufacturing of, for example, electrical conductors with improved mechanical properties looks promising

This new process for creating features on silicon wafers that are between five and 20 nanometers thick has been developed by a multidisciplinary team led by Craig Hawker, materials professor and director of the Materials Research Laboratory at UCSB and the members of his research group. Hawker worked with professors Glenn Fredrickson - and his research group - and Edward Kramer - and his research group.

PORTLAND, Ore.-Pure carbon interconnects, cast as tiny ribbons of graphene, will outperform copper interconnects below 30 nanometer line widths, according to researchers at the Georgia Institute of Technology (Georgia Tech).

Recent research into the properties of graphene nanoribbons provides two new reasons for using the material as interconnects in future computer chips. In widths as narrow as 16 nanometers, graphene has a current carrying capacity approximately a thousand times greater than copper - while providing improved thermal conductivity.

In this week's PNAS, scientists from the Universities of Nottingham and Southampton demonstrate a technique that allows the electrodeposition of 3nm copper lines that may help continue the rush to tiny features.