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s3af

shared by samwin2024 on 02 Dec 24 - No Cached
  • samwin2024 on 02 Dec 24
     
    FEATURES For surface mounted applications Low profile package Glass Passivated Chip Junction Easy to pick and place Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA Case: SMAF Terminals: Solderable per MIL-STD-750, Method 2026 Approx.Weight: 27mg/0.00095oz.
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