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samwin2024 on 02 Dec 24FEATURES For surface mounted applications Low profile package Glass Passivated Chip Junction ldeal for automated placement Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA Case: SOD.123FL Terminals: Solderable per MlL-STD-750, Method 2026 Approx. Weight: 15mg 0.0053oz.