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E-Beam Wafer Inspection System Market is mainly driven by growing adoption of consumer electronic and communication devices, increasing usage of smartphones, LCDs, SSDs, LEDs, tablets, and other wearable smart gadget

Power Electronics Market by Substrate Wafer Technology (GaN, SiC, and Others), Devices (Power IC, Power Module & Power Discrete), Applications, and Geography - Analysis & Forecast to 2014 - 2020

The system in package market based on packaging method has been segmented into flip chip (FC), wire bond and die attach (WB and DA), and fan-out wafer level packaging (FOWLP). Intel (US) was the early adopter of flip chip packaging method for packaging of its mainstream CPUs to improve the electrical and thermal performance of the processors. https://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html