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The system in package market based on packaging method has been segmented into flip chip (FC), wire bond and die attach (WB and DA), and fan-out wafer level packaging (FOWLP). Intel (US) was the early adopter of flip chip packaging method for packaging of its mainstream CPUs to improve the electrical and thermal performance of the processors. https://www.marketsandmarkets.com/Market-Reports/System-In-Package-SIP-Market-Chip-Stack-Multi-Chip-Module-MCM-Market-625.html

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