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veera90

Semiconductor Value Engineering Services | ACL Digital - 0 views

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    Considering that there is a significant challenge in the direct adoption of the same version of products across geographies, we have invested in expertise acquisition that can enable the re-designing of products with insight into the user demography, operational environment, cost, and feature expectations. Through this, we can facilitate re-design and development, productization, localization of features for ease of use, and others. Our partnerships with EMS vendors enable us to achieve volume manufacturing of re-designed products to meet the target cost.
melvinahebert

Enterprise Governance, Risk and Compliance Market Accurate and validated values Analysi... - 0 views

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    "revenues, gross profits, operating income, COGS, EBITDA, sales volume, product offerings, company landscape analysis, key strategic moves, key recent developments, and technological roadmap"
melvinahebert

10 Amazing Things You Can Make With 3D Printing - 0 views

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    Ever dreamt of a magical button which upon pressing could have your desired product ready in an instant? While you think about it, the 3D technology continues to advance at a good pace and perhaps within a handful of years, it will be possible to have almost anything manufactured at home.
veera90

Best Network Infrastructure Services & Solutions | ACL Digital - 0 views

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    Network infrastructure has evolved considerably to address the changing landscape of the IT environment. Network Equipment Manufactures (NEM) and Original Equipment Manufacturers (OEM) are re-designing the products and services portfolio to support digital disruptions in the market.
veera90

Building a robust foundation: developing a silicon validation platform | Blog - 0 views

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    The complexity of System on Chip (SoC) technology continues to grow with innovations in computing power, multi-interface support, performance, and functional capabilities. To meet the growing need for efficient and feature-rich devices, SoC manufacturers are continuously pursuing ways to pack in multiple capabilities and as many characteristics as possible while reducing the size of the chip. The rapidly advancing chip design environment, combined with the pressure to bring products to market quickly, poses significant challenges for chip developers. This results in a substantial increase in the effort necessary for SoC verification and validation.
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