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Our disco saw blades with Hub have a stronger edge, which makes the blade more rigid and keeps the edge not to being broken, so the cutting with the blade is in high efficiency and of excellent quality. E-Grind provides kinds of Disco diamond dicing blades and this dicing blade is mainly used for the cutting and dicing wafers of silicon, GaAs, gap, pzt, etc.

Henan E-Grind Abrasives Co., Ltd can offer the semiconductor industry cutting-edge dicing blades & grinding wheels of the utmost quality. Diamond tools play a significant part in the production of semiconductors from a wafer to a single chip.