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Lead Free and Tin-Lead Solder Joint Creation the Using Vapor Phase Reflow Process - 0 views

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    Standard test boards populated with common components including BGAs and QFPs were built with vapor phase and convection soldering technology and tested at Epic Technoligies, LLC facility. Reliability testing demonstrated that lead-free and tin-lead joints produced by vapor phase to be equally robust as those from convection reflow. The controllable, lower peak solder temperature makes vapor phase ideal for soldering complex assemblies having sensitive lead-free SMT components
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