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GreensTone offers a full turnkey contract manufacturing service with its strategic partners including PCB manufacturing, PCB components procurement, PCBA (Printed Circuit Board Assembly) manufacturing service and provide molding service with plastic and metal parts as a value-add service. Mainly focused on EMS (Electronics Manufacturing Service) integrated manufacturing and assembly.

A box build, known as systems integration, can be anything from a simple printed circuit board assembly housed in a small enclosure, to a cabinet housing a complex electromechanical system. Box build assembly involves everything including design, production and construction. GreensTone has more than 10 years experience in box build assembly with small enclosures like 3P meters, EV charges, smart plugs and so on. Also has experience in small cabinet housing like salt water chlorinator, PH controller and salty tester in swimming pool.

What is FR4? FR4 is the name of a type of epoxy glazing material. fr stands for flame retardant. 4 refers to the factors that differentiate it from other materials. FR4 means two things. The material. As a construction material, it refers to epoxy laminates reinforced with glass fibers. Used to make FR4 boards.

EMS "electronics manufacturing services" is commonly used interchangeably with the more general phrase "contract manufacturing (CM)". In short, EMS companies provide a wide range of value-added design and production outsourcing services and assembly services. We offer value-added services from early-stage engineering support to manufacturing testing, design for excellence and sustaining engineering for the full product life-cycle. Our electronics manufacturing services (EMS) cover almost the entire product cycle, from electronic design support to prototyping and PCB assembly, to cable and harness assembly, full system integration, product programming and testing, as well as supply-chain management.

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.